| commit | 2be4828af1c92a848af90429a9a0b44544c80553 | [log] [tgz] |
|---|---|---|
| author | Bob Feng <bob.c.feng@intel.com> | Thu Feb 27 22:25:24 2020 +0800 |
| committer | mergify[bot] <37929162+mergify[bot]@users.noreply.github.com> | Mon Mar 02 02:36:25 2020 +0000 |
| tree | 347571ed2df979714e97980ab92aae32525f8928 | |
| parent | edfe16a6d9f8c6830d7ad93ee7616225fe4e9c13 [diff] |
BaseTools: Remove invalid leading space before !INCLUDE in Makefile REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2563 This patch is to fix a incremental build regression bug which happen when using nmake. That's introduced by 818283de3f6d. If there is white space before !INCLUDE instruction, nmake will not process it. Source code's dependent header files are listed in ${deps_file} file, if it's not included successfully, nmake will not detect the change of those header file. This patch has been verified in Windows with VS2015 and Linux with GCC5. The header file add/modify/delete can trig the incremental build with this fix. There is no impact on the clean build. Cc: Andrew Fish <afish@apple.com> Cc: Laszlo Ersek <lersek@redhat.com> Cc: Leif Lindholm <leif@nuviainc.com> Cc: Michael D Kinney <michael.d.kinney@intel.com> Cc: Pierre Gondois <pierre.gondois@arm.com> Signed-off-by: Bob Feng <bob.c.feng@intel.com> Acked-by: Laszlo Ersek <lersek@redhat.com> Reviewed-by: Liming Gao <liming.gao@intel.com> Tested-by: Liming Gao <liming.gao@intel.com>
A modern, feature-rich, cross-platform firmware development environment for the UEFI and PI specifications from www.uefi.org.
The majority of the content in the EDK II open source project uses a BSD-2-Clause Plus Patent License. The EDK II open source project contains the following components that are covered by additional licenses:
The EDK II Project is composed of packages. The maintainers for each package are listed in Maintainers.txt.
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From: Contributor Name <contributor@example.com> Subject: [Repository/Branch PATCH] Pkg-Module: Brief-single-line-summary Full-commit-message Signed-off-by: Contributor Name <contributor@example.com>
[Repository/Branch PATCH]. The remaining portion of the commit message is the email’s content.git format-patch is one way to create this formatRepository is the identifier of the repository the patch applies. This identifier should only be provided for repositories other than edk2. For example edk2-BuildSpecification or staging.Branch is the identifier of the branch the patch applies. This identifier should only be provided for branches other than edk2/master. For example edk2/UDK2015, edk2-BuildSpecification/release/1.27, or staging/edk2-test.Module is a short identifier for the affected code or documentation. For example MdePkg, MdeModulePkg/UsbBusDxe, Introduction, or EDK II INF File Format.Brief-single-line-summary is a short summary of the change.Full-commit-message a verbose multiple line comment describing the change. Each line should be less than ~70 characters.Signed-off-by is the contributor's signature identifying them by their real/legal name and their email address.Submodule in EDK II is allowed but submodule chain should be avoided as possible as we can. Currently EDK II contains the following submodules
ArmSoftFloatLib is actually required by OpensslLib. It‘s inevitable in openssl-1.1.1 (since stable201905) for floating point parameter conversion, but should be dropped once there’s no such need in future release of openssl.
To get a full, buildable EDK II repository, use following steps of git command
$ git clone https://github.com/tianocore/edk2.git $ cd edk2 $ git submodule update --init $ cd ..
If there's update for submodules, use following git commands to get the latest submodules code.
$ cd edk2 $ git pull $ git submodule update
Note: When cloning submodule repos, ‘--recursive’ option is not recommended. EDK II itself will not use any code/feature from submodules in above submodules. So using ‘--recursive’ adds a dependency on being able to reach servers we do not actually want any code from, as well as needlessly downloading code we will not use.